Uses and Applications

• Measurement of material hardness, Young’s modulus, fracture toughness and other mechanical properties via nonoindentation
• Analysis of a wide variety of materials: Semiconductors, polymers, metals, thin films, and multiple layers.
• Identify topographical features indicating pre-imaging for test site specification
• Acquire additional information about the deformation in post-scanning, and measure quantitative RMS surface roughness
• Material wear analysis by controlling the amount of load applied to sample
• Maximum applicable load ~100 μN
• Nanoscale mechanical and tribological behavior of materialsat elevated temperatures up to 800°C
• Optional inert gas flow over sampleto prevent material oxidationat elevated temperature