Zeiss Xradia Versa 620 3D X-ray Microscope/Nano-CT

The X-ray Microscope provides non-destructive, 3D imaging of materials at up to 600 nm resolution

General Use and Application

    • Crystallographic imaging modalities enabled by lab DCT
    • Characterize material evolution over time (heat, cool, mechanical load)
    • In-situ heating/cooling/tension/compression stage. Up to 5kN loads to materials.
    • Large volume sample imaging enabled by Flat Panel Extension
    • Tomographic Reconstruction software
    • 3D visualization and segmentation software (Dragonfly Pro)

Click here to see the Nano-CT in operation!

For more information please contact:
Dr. Brian Van Devener (801-585-6162; b.van-devener@utah.edu)

Imaging Capabilities

  • Deben CT5000-TEC 5kN in situ load/tensile stage. Cooling/heating from -20 C to +160 C
  • High spatial resolution (600 nm)
  • High resolution imaging at large working distances (RaaD)
  • Flat panel extension (FPX) enables large volume imaging for large samples
  • Versatile sample types and sizes. Stage travel range: x – 50 mm, y – 100 mm, z – 50 mm
  • Lab DCT enables crystallographic imaging modalities
  • DragonFly Pro Software for 3D imaging and reconstruction
  • Wide Field imaging mode: 0.4x, 4x
  • High resolution 40x detector kit
  • 160kV, 25W microfocus xray source

Users Daytime Overnight
M-F: 5pm - 8am
Sat-Sun: All Day
On-Campus members $50.00 $25.00
Off-Campus Academic $77.00 $38.50
Industry $100.00 $50.00
Dr. Randy Polson Lab: 801-587-3108
Office: 801-587-0873

Specific Use and Application

Microscopy Solutions for Materials Science

  • Characterize three-dimensional structure
  • Observe failure mechanisms, degradation phenomena, and internal defects
  • Investigate properties at multiple length scales
  • Quantify microstructural evolution
  • Perform  in situ  and 4D (time dependent) studies to understand the impact of heating, cooling, desiccation, wetting, tension, compression, imbibition, drainage and other simulated environmental studies
  • Understand the 3D structure of fibers as well as pores and pore pathways in paper
  • Observe the propagation of a crack inside your sample

Electronics and Semiconductors

  • Perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages
  • Analyze printed circuit boards for reverse engineering and hardware security
  • Non-destructively image across length scales from module to package to interconnect for submicron-resolution characterization of defects at speeds that can complement physical cross-sectioning
  • Enable better understanding of defect locations and distributions by viewing unlimited virtual cross-section and plan-view images from all desired angles

Microscopy Solutions for Additive Manufacturing

  • Detailed shape, size, and volume distribution analysis of particles in Additive Manufacturing (AM) powder bed to determine proper process parameters
  • High-resolution, non-destructive imaging for microstructural analysis of AM parts
  • 3D imaging for comparison with the nominal CAD representation
  • Detection of unmelted particles, high-Z inclusions, and voids
  • Surface roughness analysis of inner structures that cannot be accessed by other methods

Microscopy Solutions for Raw Materials

  • Achieve automated mineralogy in 3D with little to no sample prep
  • Perform multiscale pore structure and fluid flow analysis, directly measure fluid flow using in situ flow equipment
  • Perform non-destructive scout scans and cut to ROI for buried structures in metamorphic rocks
  • Analyze grain orientations in steel and other metals